Decapsulation

Description

The chemical decapsulation system is dedicated to decapsulation of plastic electronic packages. The decapsulation is necessary to analyze the silicon die.

Specifications

Process liquids: nitric acid, sulfuric acid and mixtures
Temperature: from 40 to 250°C
Flow rate: from 2 to 10 ml/min
Mask and accessories for decapsulation of all types of packaging (including BGA and micro BGA).